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Oct 23.2026, 10:10:58
QUICK ANSWER Chip-on-board mounts a bare die directly onto a PCB, connects it by wire bonding or flip-chip, and protects it with encapsulation. COB can reduce height and interconnect length, but success depends on pad finish, die attach, moisture control, thermal design, and inspection.Key TakeawaysThis approach saves space by removing the IC package but moves packaging risks onto PCB assembly.Align die attach, pad finish, wire clearance, encapsulant, thermal paths, and test access.Quote with die data, a bond diagram, materials, inspection criteria, and tests.IntroductionA compact PCB can fail for reasons absent from the schematic. In chip-on-board assembly, finish, cleanliness, flatness, heat flow, and moisture protection directly affect reliability.This guide covers COB structure, manufacturing, design choices, supplier inputs, and production checks.What Is Chip on BoardChip on board attaches a bare semiconductor die directly to a PCB. Fine bond wires usually form the connections,...